CRP Technology revolutionizes with Windform SL’s super lightweight innovation.

The black material for PBF/SLS is an ultra-light polyamide-based composite reinforced with carbon fibers that combines exceptional lightweight characteristics with a low density of 0.87 g/cc.

CRP Technology has launched Windform SL, the twelfth material in its Windform TOP-LINE series. The black material for PBF/SLS is an ultra-light polyamide-based composite reinforced with carbon fibers that combines exceptional lightweight characteristics with a low density of 0.87 g/cc. Windform SL is particularly well-suited for producing functional prototypes and components in the UAV/UAS sector, and applications demanding a balance of lightness, stiffness, and thermal resistance. The heat deflection temperature at 1.82 MPa of 182.5 °C, combined with high values of Specific Tensile Modulus, Specific Tensile Strength, and Impact Strength (Charpy and Izod), are among the key features of Windform SL. The post-process surface finish is equally noteworthy, with Ra values of 5.44 µm after the SLS process, 1.56 µm after manual finishing, and 0.83 µm after CNC processing.